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The X9 series Cockpit SoCs are automobile chips designed by SemiDrive specifically for the new-generation automotive e-cockpit. It integrates high-performance CPUs, GPUs, AI accelerators, and video processors to address the growing demands of new-generation automotive e-cockpit applications for powerful computing capabilities, and rich multimedia performance, etc.
SemiDrive G9 gateway Processorsare high-performance automotive chips specifically designed for the new-generation central gateways, central computing platforms, and domain fusion controllers. With a multi-core heterogeneous design, G9 comprise high-performance Cortex-A55 CPUs and highly reliable Cortex-R5 real-time processors with dual-core lock-step. Supports new E/E architecture applications, ensuring high functional safety and reliability.
The E3 series belongs to SemiDrive's high-performance entry-level MCU product lineup, which targets at application fields such as body zone controllers, zone controllers, advanced driver assistance systems, LiDAR, and main drive inverters etc.
芯驰科技与罗姆联合开发出车载SoC X9SP参考设计，配备罗姆面向SoC的PMIC，助力智能座舱普及！
全球知名半导体制造商罗姆（总部位于日本京都市）今日宣布，与领先的车规芯片企业芯驰科技面向智能座舱联合开发出参考设计“REF68003”。该参考设计主要覆盖芯驰科技的智能座舱SoC*1“X9SP”产品，其中配备了罗姆的PMIC*2产品，并在2025年上海车展芯驰科技展台进行了展示。芯驰科技的X9系列产品全面覆盖仪表、IV
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6月17日，奇瑞汽车宣布瑞虎7高能版正式上市，作为年度改款车型配置大幅升级。其中1.5T车型搭载芯驰科技X9SP座舱芯片，支持高可靠仪表及13.2英寸超级交互AI数字屏，赋能「更懂你」的智享座舱。芯驰X9SP是X9系列智能座舱芯片的旗舰产品，作为面向智能座舱与跨域融合场景设计的全场景车规级SoC芯片，芯驰X9SP集成1
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6月14日，由中国证券报主办的2025科创金牛奖颁奖典礼在上海市普陀区举行，2025科创金牛奖获奖名单现场揭晓。芯驰科技荣膺“金牛科创企业奖（新一代信息技术）”。“金牛奖”是中国证券报鼎力打造的金融品牌，是中国资本市场最具影响力的奖项。本届科创金牛奖围绕科技创新主题，聚焦新一代信息技术、人工智能、新能源等八大战略性新兴
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