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The X9 series Cockpit SoCs are automobile chips designed by SemiDrive specifically for the new-generation automotive e-cockpit. It integrates high-performance CPUs, GPUs, AI accelerators, and video processors to address the growing demands of new-generation automotive e-cockpit applications for powerful computing capabilities, and rich multimedia performance, etc.
SemiDrive G9 gateway Processorsare high-performance automotive chips specifically designed for the new-generation central gateways, central computing platforms, and domain fusion controllers. With a multi-core heterogeneous design, G9 comprise high-performance Cortex-A55 CPUs and highly reliable Cortex-R5 real-time processors with dual-core lock-step. Supports new E/E architecture applications, ensuring high functional safety and reliability.
The E3 series belongs to SemiDrive's high-performance entry-level MCU product lineup, which targets at application fields such as body zone controllers, zone controllers, advanced driver assistance systems, LiDAR, and main drive inverters etc.
7月16日上午，北京市委书记尹力围绕“加快建设北京国际科技创新中心，发展壮大战略性新兴产业”到北京经济技术开发区调研。尹力强调，要深入贯彻落实习近平总书记关于科技创新的重要论述，充分发挥首都优势，着力建设世界领先的战略性新兴产业发展高地。经开区作为全市唯一的国家级经济技术开发区，要下好先手棋，打造战略性新兴产业发展的“
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7月7日，北京芯驰半导体科技股份有限公司（简称“芯驰科技”）到国家新能源汽车技术创新中心（简称“国创中心”）开展合作对接。芯驰科技创始人仇雨菁、副总裁陈蜀杰；国创中心党委书记、董事长续超前，副总经理邹广才；北京市高级别自动驾驶示范区工作办公室产业促进处相关负责人等参加会议。国创中心汽车芯片业务构建“4+2”业务架构，以
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芯驰科技与模拟IC设计公司立锜联合推出了面向智能座舱的参考设计“SD210”。该参考设计基于芯驰X9系列智能座舱SoC芯片，搭载了立锜的SoCPMICRTQ2209等产品，能够充分满足多样化电源需求，助力实现高性能、小型化的智能座舱系统。芯驰科技与立锜于2023年建立起先进技术开发合作伙伴关系，重点面向智能座舱相关应用
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