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The X9 series Cockpit SoCs are automotive chips designed by SemiDrive specifically for the new-generation automotive e-cockpit. It integrates high-performance CPUs, GPUs, AI accelerators, and video processors to address the growing demands of new-generation automotive e-cockpit applications for powerful computing capabilities, and rich multimedia performance, etc.
SemiDrive G9 Gateway Processors are high-performance automotive chips specifically designed for the new-generation central gateways, central computing platforms, and domain fusion controllers. With a multi-core heterogeneous design, G9 comprise high-performance Cortex-A55 CPUs and highly reliable Cortex-R5 real-time processors with dual-core lock-step. Supports new E/E architecture applications, ensuring high functional safety and reliability.
The E3 series belongs to SemiDrive's high-performance entry-level MCU product lineup, which targets at application fields such as body zone controllers, zone controllers, advanced driver assistance systems, LiDAR, and main drive inverters etc.
3月4日，2026年全国两会在北京如期召开。作为“十五五”征程扬帆起航的开局之年，头部财经媒体《每日经济新闻》以“开局谱新篇”为主题，发起“2026建言两会”大型特别策划——其意义在于为中国经济高质量发展、培育新质生产力汇聚一线声音，为国家宏观政策、产业规划、改革举措提供来自市场主体的建设性意见，凝聚发展共识。包括芯驰
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（转载自：科技日报）2025年，中国汽车产业从“量的积累”向“质的飞跃”加速迈进。随着新能源汽车渗透率的持续高位运行和智能化技术的深度普及，中国本土芯片企业正凭借持续的技术迭代与市场深耕，不断扩大在供应链中的话语权，展现出强劲的产业韧性与竞争力。近日，高工智能汽车研究院发布的2025年中国市场乘用车智能座舱芯片统计数据
More搭载主流车型超过150款！北京亦庄企业车规芯片量产交付突破1100万片
车规芯片累计交付量突破1100万片，搭载主流车型超过150款，覆盖国内90%以上主机厂及部分国际主流车企……“十五五”开局之年，芯驰科技以规模化交付的硬实力，迎来高质量发展“开门红”。近日，北京经开区企业芯驰科技副总裁陈蜀杰向小亦展示了开年亮眼成绩，他表示：“这些成果意味着我们实现了从技术研发、量产交付到市场认可的完整
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