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The X9 series Cockpit SoCs are automobile chips designed by SemiDrive specifically for the new-generation automotive e-cockpit. It integrates high-performance CPUs, GPUs, AI accelerators, and video processors to address the growing demands of new-generation automotive e-cockpit applications for powerful computing capabilities, and rich multimedia performance, etc.
SemiDrive G9 gateway Processorsare high-performance automotive chips specifically designed for the new-generation central gateways, central computing platforms, and domain fusion controllers. With a multi-core heterogeneous design, G9 comprise high-performance Cortex-A55 CPUs and highly reliable Cortex-R5 real-time processors with dual-core lock-step. Supports new E/E architecture applications, ensuring high functional safety and reliability.
The E3 series belongs to SemiDrive's high-performance entry-level MCU product lineup, which targets at application fields such as body zone controllers, zone controllers, advanced driver assistance systems, LiDAR, and main drive inverters etc.
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12月17-19日，中国汽车芯片产业创新战略联盟（以下简称“联盟”）2025全体成员大会在上海举行。本次大会以“跨界融合、共生共赢”为核心议题，汇聚了整车企业、芯片厂商、高校院所等450余家产业链上下游核心单位，共同探讨中国汽车芯片产业的创新路径与未来格局，芯驰科技受邀参加，并被授予联盟“2025年度突出贡献单位”荣誉
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12月4日，QNX2025中国年度开发者大会在上海举行，芯驰科技首席技术官孙鸣乐受邀参加并在现场发表演讲。双方联合展出了搭载芯驰X9系列座舱SoC、QNXHypervisor8.0以及Android16虚拟机的演示平台。芯驰率先成为支持QNXHypervisor8.0的本土车规SoC厂商。此前，BlackBerry有限
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