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The X9 series Cockpit SoCs are automobile chips designed by SemiDrive specifically for the new-generation automotive e-cockpit. It integrates high-performance CPUs, GPUs, AI accelerators, and video processors to address the growing demands of new-generation automotive e-cockpit applications for powerful computing capabilities, and rich multimedia performance, etc.
SemiDrive G9 gateway Processorsare high-performance automotive chips specifically designed for the new-generation central gateways, central computing platforms, and domain fusion controllers. With a multi-core heterogeneous design, G9 comprise high-performance Cortex-A55 CPUs and highly reliable Cortex-R5 real-time processors with dual-core lock-step. Supports new E/E architecture applications, ensuring high functional safety and reliability.
The E3 series belongs to SemiDrive's high-performance entry-level MCU product lineup, which targets at application fields such as body zone controllers, zone controllers, advanced driver assistance systems, LiDAR, and main drive inverters etc.
芯驰科技宣布，其专为新能源动力系统设计的高端车规MCU——E3620P已成功流片并顺利通过回片验证。该产品已提前获得多个国内新能源头部主机厂及Tier1定点锁定，并顺利开启客户送样。E3620P是芯驰专为新能源汽车先进动力系统打造的高性能、高可靠车规MCU，以单芯片的强劲性能和平台化解决方案，覆盖混动双电控、分布式电驱
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10月30日，由盖世汽车主办的2025第七届“金辑奖”颁奖典礼在上海圆满落幕。凭借领先的产品实力与量产成果，芯驰科技斩获两项重磅大奖：连续第五年荣获“中国汽车新供应链百强”创始人兼董事长仇雨菁获评“中国汽车产业影响力人物奖”2025年，中国汽车产业站在技术突破与格局重塑的双重拐点，供应链作为技术创新的源泉与基石，其战略
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10月22日，第三十二届中国汽车工程学会年会暨展览会（SAECCE2025）和汽车创新技术展（AITX）在重庆盛大开幕。作为全场景智能车芯引领企业，芯驰科技受邀参加，与来自汽车政产学研各界嘉宾共议产业创新需求，共绘智能网联新蓝图。在“创新跃迁·智联未来”主论坛高端对话环节，芯驰科技创始人兼董事长仇雨菁与重庆长安汽车副总
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