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The X9 series Cockpit SoCs are automobile chips designed by SemiDrive specifically for the new-generation automotive e-cockpit. It integrates high-performance CPUs, GPUs, AI accelerators, and video processors to address the growing demands of new-generation automotive e-cockpit applications for powerful computing capabilities, and rich multimedia performance, etc.
SemiDrive G9 gateway Processorsare high-performance automotive chips specifically designed for the new-generation central gateways, central computing platforms, and domain fusion controllers. With a multi-core heterogeneous design, G9 comprise high-performance Cortex-A55 CPUs and highly reliable Cortex-R5 real-time processors with dual-core lock-step. Supports new E/E architecture applications, ensuring high functional safety and reliability.
The E3 series belongs to SemiDrive's high-performance entry-level MCU product lineup, which targets at application fields such as body zone controllers, zone controllers, advanced driver assistance systems, LiDAR, and main drive inverters etc.
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图片来源：VS8官网8月，一汽-大众捷达VS8开启全面预售。这款定位中型SUV的新车搭载了芯驰X9智能座舱芯片，支持14.6英寸悬浮中控大屏，提供自在交互、高效实用的智能化体验。图片来源：VS8官网基于X9芯片，捷达VS8全新搭载悦行OS智能座舱系统，深度融合DeepSeek、豆包两种AI语音大模型，具备连续对话、可见
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7月27日，世界人工智能大会（WAIC2025）上，AI赋能舱驾融合新生态主题论坛顺利召开。本次论坛汇聚了众多行业领袖与专家，共同探讨AI驱动下汽车产业的未来。芯驰科技产品市场总监韩颖受邀出席发表演讲，深入阐述了芯驰如何以场景驱动为核心，为行业提供更具竞争力的AI座舱芯片解决方案。智能化浪潮奔涌，“平权”趋势重塑市场格
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