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The X9 series Cockpit SoCs are automobile chips designed by SemiDrive specifically for the new-generation automotive e-cockpit. It integrates high-performance CPUs, GPUs, AI accelerators, and video processors to address the growing demands of new-generation automotive e-cockpit applications for powerful computing capabilities, and rich multimedia performance, etc.
SemiDrive G9 gateway Processorsare high-performance automotive chips specifically designed for the new-generation central gateways, central computing platforms, and domain fusion controllers. With a multi-core heterogeneous design, G9 comprise high-performance Cortex-A55 CPUs and highly reliable Cortex-R5 real-time processors with dual-core lock-step. Supports new E/E architecture applications, ensuring high functional safety and reliability.
The E3 series belongs to SemiDrive's high-performance entry-level MCU product lineup, which targets at application fields such as body zone controllers, zone controllers, advanced driver assistance systems, LiDAR, and main drive inverters etc.
6月14日，由中国证券报主办的2025科创金牛奖颁奖典礼在上海市普陀区举行，2025科创金牛奖获奖名单现场揭晓。芯驰科技荣膺“金牛科创企业奖（新一代信息技术）”。“金牛奖”是中国证券报鼎力打造的金融品牌，是中国资本市场最具影响力的奖项。本届科创金牛奖围绕科技创新主题，聚焦新一代信息技术、人工智能、新能源等八大战略性新兴
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6月12日，2025首届国际汽车及供应链博览会（香港）在亚洲博览馆正式开幕。作为中国汽车国际化的重要窗口，本届香港车博会汇聚全球产业力量，中国智能车芯引领企业芯驰科技首度参展，面向全球展现中国智能座舱和智能车控芯片产品的技术创新与量产实践，与海内外产业链伙伴深入交流，共话未来发展新机遇。本届香港车博会以“新汽车·新征程
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