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X9 Cockpit SoCs

X9 Cockpit SoCs

The X9 series Cockpit SoCs are automobile chips designed by SemiDrive specifically for the new-generation automotive e-cockpit. It integrates high-performance CPUs, GPUs, AI accelerators, and video processors to address the growing demands of new-generation automotive e-cockpit applications for powerful computing capabilities, and rich multimedia performance, etc.

The X9 series products comprehensively cover e-cockpit application scenarios from entry-level to flagship-level, such as virtual cluster, IVI, e-cockpit domain controller, and integrated parking and infotainment system. They have already become the mainstream choice for intelligent automotive e-cockpit chips in China. Currently, there are dozens of high-profile vehicle models with fixed-point installations. Vehicle models equipped with X9 series chips from automakers such as SAIC Motor, Chery Automobile, Changan Automobile, GAC Group, BAIC Group, Dongfeng Nissan, and GAC Honda have all been mass-produced and rolled out on the market.

Product Layout

3D cluster/central control

X9E | X9M | X9H | X9S

10-70 KDMIPS
4-200 GFLOPS
0.2-4 TOPS
  • 16nm Automotive-grade Process
  • ARMV8.2 CPU.MP2-MP8
  • 1080P cluster / 1080P-2.5K central control
  • AVM + DMS + DVR
  • AEC-Q100 Grade 2. IsO26262 ASIL B
  • Mass production and delivery started in 2021, a full range of products now in mass production

E-cockpit domain controller/integrated parking and infotainment system

X9HP | X9U | X9SP

50-100 KDMIPS
140-300 GFLOPS
0.4-8 TOPS
  • 16nm Automotive-grade Process
  • ARMv8.2 CPU,Hardware-Independent Architecture
  • 1080P cluster +2.5K central control+HUD
  • AVM + APA + DMS + OMS + DVR!
  • AEC-0100 Grade 2 ISO26262 ASIL B
  • Mass production and delivery started in 2023, a full range of products now in mass production

AI e-cockpit

X10 Series

  • 4nm Automotive-grade Process
  • ARMv92CPU,Hard isolation/virtualization architecture
  • 2K instrument+HUD+4K Central control& Co pilot
  • AVM + APA + DMS + OMS + DVR
  • Support deployment of end-to-end large models and support Al Agent
  • AEC Q100 Grade 3.ISO26262 ASIL B
Product Performance
High-performance Processor
  • Cortex-A55 multi-cluster architecture; High frequency.
  • Supports multi-screen independent display with high definition and high frame rate.
  • Supports operating systems such as QNX, Linux, and Android, as well as multiple systems on a single chip.
  • Efficient resource allocation capability across different domains/cores.
High-performance Built-in AI Unit
  • Supports deployment of AI applications such as OMS/DMS and speech recognition.
  • Supports hybrid deployment of large models on cloud and edge, with local multi-modal perception.
  • Supports algorithms for intelligent driving scenarios (driving/parking).
High Reliability
  • AEC-Q100 reliability certification.
  • ASIL B product certification of ISO 26262 for functional safety.
  • Built-in independent hardware-isolated safety island.
  • Integrates hardware security module (HSM).
Application Scenarios
  • Design of product family, with a comprehensive product matrix covering applications such as 3D cluster, IVI, e-cockpit domain controller, integrated parking and infotainment system, integrated parking, driving and infotainment system, and central computing platform etc.
  • Both hardware Pin-to-Pin compatibility and software compatibility.
Product Family
Device NameX9EX9E 1.6GX9MX9M 2.0GX9HX9H2.0GX9SX9HPX9SPX9U
Part NumberX9240X9260X9460X9480X9660X9669X9870X9699X9880X9892
CPU Cluster 1MP2 @1.4GHzMP2 @1.6GHzMP4 @1.6GHzMP4 @2.0GHzMP6 @1.6GHzMP6 @2.0GHzMP8 @2.3GHzMP6 @2.0GHzMP8 @2.3GHz2 x MP6 @2.0GHz
CPU Cluster 2-------MP1 @1.4GHzMP4 @2.0GHz2 x MP1 @1.4GHz
CPU DMIPS(K)10.512243036457050100100K
GPU GFLOPS40408080140140230140230300G
NPU------4 TOPS-8 TOPS-
DSP-1 x vDSP1 x vDSP1 x vDSP1 x vDSP1 x vDSP1 x vDSP1 x vDSP2 x vDSP2 x vDSP
ISP------1Gpixel/s-1Gpixel/s-
DDR LPDDR4/4xup to 8GBup tp 8GBup to 8GBup tp 8GBup to 8GBup tp 8GBup tp 16GBup tp 8GBup tp 16GBup tp 16GB
Video H.264Encoder/DecoderEncoder/DecoderEncoder/DecoderEncoder/DecoderEncoder/DecoderEncoder/DecoderEncoder/Decoder-Encoder/DecoderEncoder/DecoderEncoder/Decoder
Video H.265-DecoderDecoderDecoderDecoderDecoderEncoder/DecoderDecoderEncoder/DecoderDecoder
FHD Display2x2x3x3x4x4x4x4x4x8x
LVD(4-ch)2x2x4x4x4x4x4x4x4x8x
MIPI DSI(4-Lane)1x2x1x2x2x2x2x2x2x4x
Parallel CSI1x1x1x1x1x1x1x1x1x2x
MIPI CSI(4-Lane)1x2x2x2x2x2x2x2x2x4x
USB3.02x2x2x2x2x2x2x2x2x4x
PCle 3.01x 1-lane1x 1-lane2x 1-lane2x 1-lane2x 1-lane2x 1-lane2x 1-lane2x 1-lane2x 1-lane2x 1-lane
eMMC2x eMMC5.12x eMMC5.12x eMMC5.12x eMMC5.12x eMMC5.12x eMMC5.12x eMMC5.12x eMMC5.12x eMMC5.12x eMMC5.1
Ethernet1x1G Ethernet TSN1x1G Ethernet TSN1x1G Ethernet TSN1x1G Ethernet TSN1x1G Ethernet TSN1x1G Ethernet TSN1x1G Ethernet TSN1x1G Ethernet TSN1x1G Ethernet TSN2x1G Ethernet TSN
CAN-FD2x2x2x2x2x2x2x2x2x4x
Multi-Purpose Processor-Cortex-R5 DCLS-Cortex-R5 DCLS-Cortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLS2xR5 DCLS
Secure ProcessorCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLS2xR5 DCLS
Safety IslandCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLSCortex-R5 DCLS2xR5 DCLS
Functional SafetyASIL BASIL BASIL BASIL BASIL BASIL BASIL BASIL BASIL BASIL B
Auto GradeAEC-Q100 Grade 2AEC-Q100 Grade 2AEC-Q100 Grade 2AEC-Q100 Grade 2AEC-Q100 Grade 2AEC-Q100 Grade 2AEC-Q100 Grade 2AEC-Q100 Grade 2AEC-Q100 Grade 2AEC-Q100 Grade 2
Note:
Hardware isolation for each CPU Cluster
All the devices except X9U are pin-to-pin and software compatible.
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