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The X9 series Cockpit SoCs are automobile chips designed by SemiDrive specifically for the new-generation automotive e-cockpit. It integrates high-performance CPUs, GPUs, AI accelerators, and video processors to address the growing demands of new-generation automotive e-cockpit applications for powerful computing capabilities, and rich multimedia performance, etc.
SemiDrive G9 gateway Processorsare high-performance automotive chips specifically designed for the new-generation central gateways, central computing platforms, and domain fusion controllers. With a multi-core heterogeneous design, G9 comprise high-performance Cortex-A55 CPUs and highly reliable Cortex-R5 real-time processors with dual-core lock-step. Supports new E/E architecture applications, ensuring high functional safety and reliability.
The E3 series belongs to SemiDrive's high-performance entry-level MCU product lineup, which targets at application fields such as body zone controllers, zone controllers, advanced driver assistance systems, LiDAR, and main drive inverters etc.
芯驰受邀参加QNX 2025中国年度开发者大会，携手赋能座舱未来
12月4日，QNX2025中国年度开发者大会在上海举行，芯驰科技首席技术官孙鸣乐受邀参加并在现场发表演讲。双方联合展出了搭载芯驰X9系列座舱SoC、QNXHypervisor8.0以及Android16虚拟机的演示平台。芯驰率先成为支持QNXHypervisor8.0的本土车规SoC厂商。此前，BlackBerry有限
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01.引言当智能汽车以120km/h的速度疾驰时，每一毫秒的计算延迟都可能关乎生命安全。在理想汽车星环OS（HaloOS）的硬实时系统中，MCU芯片承担着整个系统的"神经中枢"角色——它必须在严格的时间约束内，精准完成从传感器数据采集、实时决策到执行器控制的全链路处理。作为HaloOS的智控首发平台
More芯驰E3620B开启送样，助力车企将先进E/E架构加速普及至海量车型
全场景智能车芯引领者芯驰科技宣布，其高端车规MCU芯片E3620B已开启客户送样，该产品覆盖区域控制、车身域控、智驾域控等应用场景，可支持车身+动力+底盘的跨域控制融合，重点面向10-15万价格区间海量车型，赋能先进汽车电子电气架构的迅速普及。送样伊始，E3620B即获得多家明星车企定点，成为车控MCU的明星方案。E3
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